|
|
Journal of Korean Society for Quality Management 1997;25(1): 135-. |
| 금형보정을 이용한 PCB 품질향상에 관한 실험 |
| 전영호, 권이장 |
| 홍익대학교 산업공학과 |
| A Test on Quality Improvement of Printed Circuit Board Using Mold Compensation |
|
|
|
|
|
|
| ABSTRACT |
|
The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${pm}$$100{mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%. |
|
|
|
PDF Links
Full text via DOI 
Download Citation 
